SLM Platinum Plus
Reduced Gold Alloys for Ceramics
| Color | WHITE |
| Type | 4 |
| ADA Class | NOBLE (N) |
|
Application
  
|
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| Processing | |
|---|---|
| Investment | Phosphate Bonded (Carbon Free) |
| Crucible | Ceramic |
| Degassing Temp C | 600-980 |
| Oxidation Procedure | Vacuum, No Hold, Remove Oxide |
| Solder & Laser Wires | |
|---|---|
| PreSolder | Co/Cr Pre |
| PostSolder | |
| Laser Wire | LWNPCO |
| Physical Properties | |
|---|---|
| VHN After Firing | 314 |
| VHN Soft | |
| VHN Hard | |
| Proof Stress Soft MPa | 899 |
| Proof Stress Hard MPa | |
| Tensile Strength Soft MPa | 1000 |
| Tensile Strength Hard MPa | |
| Elongation Soft | 10 |
| Elongation Hard | |
| Elastic Modulus GPa | 190 |
| Composition | |
|---|---|
| Cobalt (Co) | 43.5 |
| Manganese (Mn) | 0.5 |
| Platinum (Pt) | 20.0 |
| Silicon (Si) | 1.0 |
| Chromium (Cr) | 29.3 |
| Ruthenium (Ru) | 5.7 |
| Thermal Properties | |
|---|---|
| Melting Range C | 1370-1420 |
| Casting Temp C | 1500 |
| Density g/cc | 9.45 |
| Expansion at 500C | 14.3 |
| Expansion at 600C | 14.6 |
| Burnout Temp C | 870 |