SLM Non-Precious
Non-Precious Alloys
| Color | WHITE |
| Type | 4 |
| ADA Class | Predominantly Base (PB) |
|
Application
|
|
| Processing | |
|---|---|
| Investment | N/A |
| Crucible | N/A |
| Degassing Temp C | 650-1010 |
| Oxidation Procedure | Hold 0 Min With Vacuum, Remove Oxide |
| Solder & Laser Wires | |
|---|---|
| PreSolder | Co/Cr Pre |
| PostSolder | LO, R |
| Laser Wire | LWNPCO |
| Physical Properties | |
|---|---|
| VHN After Firing | 365 |
| VHN Soft | |
| VHN Hard | |
| Proof Stress Soft MPa | 474 |
| Proof Stress Hard MPa | |
| Tensile Strength Soft MPa | |
| Tensile Strength Hard MPa | |
| Elongation Soft | 8 |
| Elongation Hard | |
| Elastic Modulus GPa | 223 |
| Composition | |
|---|---|
| Nickel (Ni) | 0.08 |
| Chromium (Cr) | 25.0 |
| Cobalt (Co) | 61.0 |
| Molybdenum (Mo) | 6.0 |
| Silicon (Si) | 1.0 |
| Manganese (Mn) | 0.6 |
| Iron (Fe) | 0.5 |
| Tungsten (W) | 5.0 |
| Carbon (C) | 0.02 |
| Thermal Properties | |
|---|---|
| Melting Range C | 1350-1385 |
| Casting Temp C | |
| Density g/cc | 8.6 |
| Expansion at 500C | 14.1 |
| Expansion at 600C | 14.5 |
| Burnout Temp C |