Argedent 40SF
Reduced Gold Alloys for Ceramics
| Color | WHITE |
| Type | 4 |
| ADA Class | HIGH NOBLE (HN) |
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Application
  
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| Processing | |
|---|---|
| Investment | Phosphate Bonded (Carbon Free) |
| Crucible | Ceramic |
| Degassing Temp C | |
| Oxidation Procedure | No Hold, No Vacuum, Remove Oxide |
| Solder & Laser Wires | |
|---|---|
| PreSolder | WSF |
| PostSolder | LO |
| Laser Wire | LWT52SF |
| Physical Properties | |
|---|---|
| VHN After Firing | 225 |
| VHN Soft | |
| VHN Hard | |
| Proof Stress Soft MPa | 450 |
| Proof Stress Hard MPa | |
| Tensile Strength Soft MPa | 740 |
| Tensile Strength Hard MPa | |
| Elongation Soft | 35 |
| Elongation Hard | |
| Elastic Modulus GPa | 160 |
| Composition | |
|---|---|
| Gold (Au) | 40.0 |
| Cobalt (Co) | 3.0 |
| Palladium (Pd) | 50.7 |
| Tin (Sn) | 3.0 |
| Ruthenium (Ru) | 0.1 |
| Gallium (Ga) | 3.0 |
| Lithium (Li) | 0.1 |
| Rhenium (Re) | 0.1 |
| Thermal Properties | |
|---|---|
| Melting Range C | 1150-1300 |
| Casting Temp C | 1400 |
| Density g/cc | 13.9 |
| Expansion at 500C | 14.1 |
| Expansion at 600C | 14.3 |
| Burnout Temp C | 815 |