DPM Argedent 500
Reduced Gold Alloys for Ceramics
| Color | WHITE |
| Type | 4 |
| ADA Class | HIGH NOBLE (HN) |
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Application
  
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| Processing | |
|---|---|
| Investment | Phosphate Bonded |
| Crucible | Ceramic |
| Degassing Temp C | |
| Oxidation Procedure | No Hold, Do Not Remove Oxide, No Vacuum |
| Solder & Laser Wires | |
|---|---|
| PreSolder | W, WSF |
| PostSolder | LO |
| Laser Wire | LWT52 |
| Physical Properties | |
|---|---|
| VHN After Firing | 250 |
| VHN Soft | |
| VHN Hard | |
| Proof Stress Soft MPa | 550 |
| Proof Stress Hard MPa | |
| Tensile Strength Soft MPa | 690 |
| Tensile Strength Hard MPa | |
| Elongation Soft | 7 |
| Elongation Hard | |
| Elastic Modulus GPa | 119 |
| Composition | |
|---|---|
| Silver (Ag) | 19.15 |
| Gold (Au) | 50.0 |
| Indium (In) | 5.5 |
| Palladium (Pd) | 24.9 |
| Gallium (Ga) | 0.35 |
| Iridium (Ir) | 0.1 |
| Thermal Properties | |
|---|---|
| Melting Range C | 1120-1230 |
| Casting Temp C | 1345 |
| Density g/cc | 13.9 |
| Expansion at 500C | 14.6 |
| Expansion at 600C | 14.8 |
| Burnout Temp C | 815 |