Argelite 55
Palladium Base Alloys for Ceramics
| Color | WHITE |
| Type | 4 |
| ADA Class | NOBLE (N) |
|
Application
  
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| Processing | |
|---|---|
| Investment | Phosphate Bonded |
| Crucible | Ceramic |
| Degassing Temp C | 650-980 |
| Oxidation Procedure | Hold 10 Min, Removal Of Oxide Optional, No Vacuum |
| Solder & Laser Wires | |
|---|---|
| PreSolder | W / P |
| PostSolder | LO / 500 |
| Laser Wire | LWL58 |
| Physical Properties | |
|---|---|
| VHN After Firing | 170 |
| VHN Soft | |
| VHN Hard | 330 |
| Proof Stress Soft MPa | 400 |
| Proof Stress Hard MPa | 724 |
| Tensile Strength Soft MPa | 641 |
| Tensile Strength Hard MPa | 966 |
| Elongation Soft | 38 |
| Elongation Hard | 10 |
| Elastic Modulus GPa | 125 |
| Composition | |
|---|---|
| Silver (Ag) | 34.0 |
| Indium (In) | 6.0 |
| Palladium (Pd) | 55.15 |
| Tin (Sn) | 3.0 |
| Zinc (Zn) | 1.0 |
| Ruthenium (Ru) | 0.08 |
| Gallium (Ga) | 0.7 |
| Rhenium (Re) | 0.08 |
| Thermal Properties | |
|---|---|
| Melting Range C | 1170-1265 |
| Casting Temp C | 1370 |
| Density g/cc | 11.1 |
| Expansion at 500C | 14.8 |
| Expansion at 600C | 15 |
| Burnout Temp C | 815 |