Argelite 50
Palladium Base Alloys for Ceramics
| Color | WHITE |
| Type | 4 |
| ADA Class | NOBLE (N) |
|
Application
  
|
|
| Processing | |
|---|---|
| Investment | Phosphate Bonded |
| Crucible | Ceramic |
| Degassing Temp C | |
| Oxidation Procedure | Hold 10 Min, Removal Of Oxide Optional, No Vacuum |
| Solder & Laser Wires | |
|---|---|
| PreSolder | W, P |
| PostSolder | LO, 500 |
| Laser Wire | LWL58 |
| Physical Properties | |
|---|---|
| VHN After Firing | 240 |
| VHN Soft | |
| VHN Hard | |
| Proof Stress Soft MPa | 552 |
| Proof Stress Hard MPa | |
| Tensile Strength Soft MPa | 690 |
| Tensile Strength Hard MPa | |
| Elongation Soft | 6 |
| Elongation Hard | |
| Elastic Modulus GPa | 138 |
| Composition | |
|---|---|
| Silver (Ag) | 40.0 |
| Gold (Au) | 0.1 |
| Indium (In) | 5.0 |
| Palladium (Pd) | 49.6 |
| Tin (Sn) | 4.0 |
| Zinc (Zn) | 1.0 |
| Ruthenium (Ru) | 0.15 |
| Rhenium (Re) | 0.15 |
| Thermal Properties | |
|---|---|
| Melting Range C | 1205-1245 |
| Casting Temp C | 1345 |
| Density g/cc | 10.9 |
| Expansion at 500C | 15.1 |
| Expansion at 600C | 15.3 |
| Burnout Temp C | 815 |