Argedent 52SF
Reduced Gold Alloys for Ceramics
| Color | WHITE |
| Type | 4 |
| ADA Class | HIGH NOBLE (HN) |
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Application
  
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| Processing | |
|---|---|
| Investment | Phosphate Bonded (Carbon Free) |
| Crucible | Ceramic |
| Degassing Temp C | n/a |
| Oxidation Procedure | No Hold, Do Not Remove Oxide, No Vacuum |
| Solder & Laser Wires | |
|---|---|
| PreSolder | WSF |
| PostSolder | LO, 500 |
| Laser Wire | LWT52SF |
| Physical Properties | |
|---|---|
| VHN After Firing | 230 |
| VHN Soft | |
| VHN Hard | |
| Proof Stress Soft MPa | 565 |
| Proof Stress Hard MPa | |
| Tensile Strength Soft MPa | 793 |
| Tensile Strength Hard MPa | |
| Elongation Soft | 20 |
| Elongation Hard | |
| Elastic Modulus GPa | 124 |
| Composition | |
|---|---|
| Gold (Au) | 51.5 |
| Indium (In) | 8.5 |
| Palladium (Pd) | 38.4 |
| Gallium (Ga) | 1.4 |
| Iridium (Ir) | 0.2 |
| Thermal Properties | |
|---|---|
| Melting Range C | 1275-1300 |
| Casting Temp C | 1370 |
| Density g/cc | 14.5 |
| Expansion at 500C | 13.9 |
| Expansion at 600C | 14.1 |
| Burnout Temp C | 815 |